I am in the process of designing a new print-bed with it's adjusting and heating substructure for my new Felix 3.0. (I will post it on this forum once done).
I intend to make the print-bed easily removable from the adjusting and heating sub-structure for easy maintenance (printed parts removal) and also allow the print surface to be replaced with i.e. alloy, glass etc.
To make the print-bed removable from the heating surface I will replace the existing self adhesive kapton heater-pad with a silicone heater-pad, use some mechanism to apply some pressure from below, and use the silicone adhesion for thermal contact.
Here the technical questions relating to the 3.0 controller board:
1- I presume the out specs of the 3.0 PCB relate to the power supply.
2- What are the power supply specs (V, A, W)
3- If the power supply is replaced with a higher rating one (A), what are the Max Output specifications of the heat-bed and print-heads connections of the Felix v3.0 controller board (V, A, W)
4- What is the technical specs. of the existing new kapton heat-pad. (V, A, W)
thanks for your answers
regards George (GGY)
